Printed Circuit Boards

Kompania Elektroniczna produces printed circuit boards for all applications. Our goal is to satisfy your needs, we achieve this through quality, promptness and competitive prices. Printed circuit boards produced by Kompania Elektroniczna are controlled on each stage of production and finally, these tests prove the high quality of our product.

Production processes

• Drilling and milling
• Copper and Sn/Pb coating
• Photo-etching
• Mosaic coating using photo print and screen process
• Tin-coating using HAL method
• Solder mask coating using photo print and screen process
• Description printing using screen process
• Boards incising in technological layout
• Gold coating
• Graphite coating

Technological specifications

• minimal path wideness — 0,18 mm (7 mils)
• minimal distance between paths — 0,2 mm (8 mils)
• drilled holes — from 0,4 to 6,5 mm (from 15 to 256 mils)
• minimal distance between path edge and board edge — 0,3 mm (12 mils)
• minimal distance between soldered area and solder mask edge — 0,127 mm (5 mils)
• types of used laminates: FR2, FR3, FR4, CEM-1, ALU and more
• V - cutting— tolerance ± 0,3 mm
• milling CNC — tolerance ± 0,15 mm
• notching — tolerance ± 0,5 mm